[1]张玲,田泽. 陶瓷管壳设计及验证过程研究[J].计算机技术与发展,2016,26(06):155-157.
　ZHANG Ling,TIAN Ze. Analysis of Design and Verification for Complex Ceramic Tube[J].,2016,26(06):155-157.
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 陶瓷管壳设计及验证过程研究()
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《计算机技术与发展》[ISSN:1006-6977/CN:61-1281/TN]

卷:
26
期数:
2016年06期
页码:
155-157
栏目:
应用开发研究
出版日期:
2016-06-10

文章信息/Info

Title:
 Analysis of Design and Verification for Complex Ceramic Tube
文章编号:
1673-629X（2016)06-00155-03
作者:
 张玲; 田泽
 中国航空工业集团公司 西安航空计算技术研究所；集成电路与微系统设计航空科技重点实验室
Author(s):
 ZHANG Ling; TIAN Ze
关键词:
 ; 陶瓷管壳; 管壳设计; 仿真; 陶瓷封装
Keywords:
 ; ceramic tube; tube design; simulation; ceramic packaging
分类号:
TP39
文献标志码:
A
摘要:
 随着集成电路设计规模的不断增加，管壳的设计也日趋复杂。通用管壳往往已经无法满足电气、机械及可靠性要求，需要针对管芯的物理特性及要求进行管壳的定制。陶瓷管壳以其气密性好，可以多层布线，绝缘阻抗高，热膨胀系数与芯片接近等优点，得到了越来越广泛的应用。文中从管壳的需求确认、管壳设计、管壳的仿真验证三个方面对目前复杂陶瓷管壳设计过程进行了分析，研究了大规模集成电路陶瓷管壳需求确认、电设计、热设计、机械设计、电学仿真、热仿真及结构仿真、板级仿真的过程及方法。
Abstract:
 With the booming of chip’ s complexity,tube design is becoming more and more complex. General tube has been unable to meet the electrical,mechanical and reliable requirements,needing customization in view of physical characteristics and requirements for tube core. For the reason of many advantages,such as good air tightness,multilayer writing,high insulation resistance and the very closely coefficient of thermal expansion to chip,ceramic tube has been used more widely. From three aspects including confirmation of require-ments,tube design and tube verification,the procedure of design and verification of complex ceramic tube is analyzed and the method of requirements confirmation,electrical design,thermal design,mechanical design,simulation and verification for electrical,thermaland PCB structure is researched.

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更新日期/Last Update: 2016-09-26